Personal Information

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[1]Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[2]Qiao, Y. Y., Wu, C. M. L., Wang, Y. P., Ma, H. T., Zhao, N., Liu, C. Y., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates ...[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[3]Gao, Zhaoqing, Cao, Jinwei, Muzammal , Hussain Muhammad, Wang, Chen, Sun, Hao, Dong, Chong, Ma, Haitao, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
[4]Zhu, Zhidan, Ma, Haoran, Shang, Shengyan, Haitao, Wang, Yunpeng, Li, Xiaogan, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Ma, HR (reprint author), Sch Microelect.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interfac...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
[5]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Ma, Haitao, Wang, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints r...[J],THIN SOLID FILMS,2019,669:198-207
[6]Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Ad...[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[7]Kunwar, Anil, Zhao, Ning, Huang, Mingliang, Ma, Haoran, Haitao, Sun, Junhao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2018,230:76-76
[8]Yao, Mingjun, Ma, Haitao, Xiao, Zhiyi, Yu, Daquan, Wang, Teng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatt...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[9]Zhong, Y., Zhao, N., Dong, W., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[10]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972

total225 1/23

firstpreviousnext last Page

Home

Scientific Research

Teaching Research

Awards and Honours

Enrollment Information

Student Information

My Album

Blog

Personal Information

Paper Publications